Thesis abstract:
As silicon technology continues its drive toward ever-smaller electronic components —where the channel thickness in modern field-effect transistors is already reduced to ∼5 nm to sustain the trajectory predicted by Moore’s law— thermal management emerges as a critical challenge. Conventional three-dimensional materials like silicon suffer performance degradation at the nanoscale, primarily due to enhanced surface scattering from a higher proportion of surface atoms and an increased density of dangling bonds. To sustain miniaturization while adding new functions to silicon chips, two-dimensional (2D) materials offer a compelling path forward. Because they are atomically thin and exhibit anisotropic thermal properties, 2D materials are well suited to hybrid 3D–2D integration, potentially adding sensing, photonic and memristive capabilities for neuromorphic computing in future electronic and optoelectronic platforms. In this work, we contribute to the fundamental understanding of 2D material properties with an experimental investigation of phonon-mediated heat transport in transition metal dichalcogenides (TMDs). We focus on how thickness and environmental conditions influence their interfacial and thermal conductivities. First, we develop a system to transfer and manipulate 2D materials, with which we prepare record-large suspended flakes down to the monolayer thickness [Chapter 3]. Second, we build a versatile optical setup specifically designed to explore thermal transport in nanoscale systems [Chapters 4 and 5]. Third, using our ultrafast time-domain thermoreflectance setup, we present preliminary insights into coherent out-of-plane heat transport in MoS2 flakes with varying thicknesses down to the monolayer and at varying temperatures. We discuss the results in terms of possible effects of coherent phonons and coherent photons [Chapters 6 and 7]. Finally, using non-contact, steady-state Raman thermometry we determine the intrinsic in-plane thermal conductivity of MoSe2 across various thicknesses, and find an enhanced heat dissipation capabilities to environmental molecules for the thinnest flakes [Chapter 8]. Our findings contribute to the fundamental understanding of heat dissipation in van der Waals materials and support their integration into emerging technologies.